---
title: "TSMC will outsource more advanced semiconductor packaging and testing work in 2026 as orders for CoW"
description: "TSMC will outsource more advanced semiconductor packaging and testing work in 2026 as orders for CoWoS and advanced 3nm and below processes are fully book, media report. ASE, KYEC and Powertech are se"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000277948.md"
published_at: "2025-10-16T00:01:01.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# TSMC will outsource more advanced semiconductor packaging and testing work in 2026 as orders for CoW

TSMC will outsource more advanced semiconductor packaging and testing work in 2026 as orders for CoWoS and advanced 3nm and below processes are fully book, media report. ASE, KYEC and Powertech are seen as benefiting. ASE and KYEC have order visibility through end-2026 and are building new plants to meet demand. Rumors say KYEC may build in Singapore. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #Singapore #semiconductors

Source: Dan Nystedt

### Related Stocks

- [TSM.US - Taiwan Semiconductor](https://longbridge.com/en/quote/TSM.US.md)
- [ASX.US - Advanced Semiconductor Engineering](https://longbridge.com/en/quote/ASX.US.md)
- [AMKR.US - Amkor Tech](https://longbridge.com/en/quote/AMKR.US.md)

---

> **Disclaimer**: This article is for reference only and does not constitute any investment advice.