---
title: "Rumor: Apple’s 2nm chip for the iPhone 18 will use TSMC’s WMCM advanced packaging for better yield, "
description: "Rumor: Apple’s 2nm chip for the iPhone 18 will use TSMC’s WMCM advanced packaging for better yield, heat management, interconnect density, than the InFO used previously, media report, with TSMC partne"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000408968.md"
published_at: "2026-01-20T00:08:50.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# Rumor: Apple’s 2nm chip for the iPhone 18 will use TSMC’s WMCM advanced packaging for better yield, 

Rumor: Apple’s 2nm chip for the iPhone 18 will use TSMC’s WMCM advanced packaging for better yield, heat management, interconnect density, than the InFO used previously, media report, with TSMC partners ASE and Xintec to help with wafer sorting and final test. TSMC’s main WMCM production will be at its Longtan plant, AP3, while another line will be built in Chiayi. Capacity in 2027 is seen at 120,000 wafers-per-month vs 60,000 this year. The report cites unnamed supply chain sources. $Apple(AAPL.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #xintec #semiconductors #semiconductor

Source: Dan Nystedt

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> **Disclaimer**: This article is for reference only and does not constitute any investment advice.