---
title: "Samsung’s 2nm process is a real threat to TSMC in smartphone chips, media report, as Samsung’s Exyno"
description: "Samsung’s 2nm process is a real threat to TSMC in smartphone chips, media report, as Samsung’s Exynos 2600 chip revealed a breakthrough FoWLP-HPB packaging technique better-able to cool chips, appeali"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000416256.md"
published_at: "2026-01-22T02:21:21.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# Samsung’s 2nm process is a real threat to TSMC in smartphone chips, media report, as Samsung’s Exyno

Samsung’s 2nm process is a real threat to TSMC in smartphone chips, media report, as Samsung’s Exynos 2600 chip revealed a breakthrough FoWLP-HPB packaging technique better-able to cool chips, appealing to giants like Apple, MediaTek, Qualcomm. FoWLP-HPB: Fan-Out Wafer-Level Packaging (w/integrated) Heat Path Block $SSNLF $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $Qualcomm(QCOM.US) #mediatek #semiconductors #smartphones

Source: Dan Nystedt

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- [MTK.NA - MediaTek](https://longbridge.com/en/quote/MTK.NA.md)
- [AAPL.US - Apple](https://longbridge.com/en/quote/AAPL.US.md)

---

> **Disclaimer**: This article is for reference only and does not constitute any investment advice.