---
title: "Powertech, the memory chip packaging and testing firm, raised its 2026 capex plan to NT$44.3 billion"
description: "Powertech, the memory chip packaging and testing firm, raised its 2026 capex plan to NT$44.3 billion (US$1.41 billion) from NT$40 billion previously to expand advanced semiconductor packaging capacity"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000423409.md"
published_at: "2026-01-26T00:11:20.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# Powertech, the memory chip packaging and testing firm, raised its 2026 capex plan to NT$44.3 billion

Powertech, the memory chip packaging and testing firm, raised its 2026 capex plan to NT$44.3 billion (US$1.41 billion) from NT$40 billion previously to expand advanced semiconductor packaging capacity, media report, adding much of the spending will be on FOPLP (Fan-Out Panel-Level-Packaging) lines. Powertech is expected to hire 2,044 workers for the new production lines. #semiconductors

Source: Dan Nystedt

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> **Disclaimer**: This article is for reference only and does not constitute any investment advice.