---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000832395.md"
description: "Intel’s EMIB-T advanced packaging costs 50% less than TSMC CoWoS, media report, adding EMIB-T will begin mass production next year as yields now exceed 90% - though another report says a 50% substrate yield remains the bottleneck. -EMIB-T has already won Intel at least one AI ASIC chip project from MediaTek (likely a Google TPU)-Broadcom and Meta are now evaluating EMIB-T. -Two Intel partners in Taiwan are rapidly expanding production: Powerchip as its exclusive silicon capacitor supplier, and UMC for silicon bridges. -Taiwan’s Unimicron is the substate partner for EMIB-T. -For Intel EMIB-T cost and yield data, Taiwan media cite Wccftech for Intel EMIB-T cost, yield data, and Wccftech cites X handle @imnotharsh $Intel(INTC.US) $United Microelectronics(UMC.US) $Alphabet(GOOGL.US) $Broadcom(AVGO.US) $Meta Platforms(META.US)Source: Dan Nystedt"
datetime: "2026-08-04T00:06:43.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000832395.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000832395.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000832395.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Intel’s EMIB-T advanced packaging costs 50% less t…


### Related Stocks

- [GOOGL.US](https://longbridge.com/en/quote/GOOGL.US.md)
- [AVGO.US](https://longbridge.com/en/quote/AVGO.US.md)
- [GOOG.US](https://longbridge.com/en/quote/GOOG.US.md)
- [INTC.US](https://longbridge.com/en/quote/INTC.US.md)
- [GOOGN.US](https://longbridge.com/en/quote/GOOGN.US.md)
- [04335.HK](https://longbridge.com/en/quote/04335.HK.md)
- [TSM.US](https://longbridge.com/en/quote/TSM.US.md)
- [META.US](https://longbridge.com/en/quote/META.US.md)
- [UMC.US](https://longbridge.com/en/quote/UMC.US.md)

---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**