---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000853957.md"
description: "Nvidia’s next generation chip platform, Feynman is ahead of schedule, will use TSMC’s A16 process, and CPO (co-packaged optics), DigiTimes reports, with TSMC full speed ahead to meet 2028 mass production. -Nvidia is rapidly shifting its supply chain to put Feynman out in the 2nd half of 2028-Feynman uses 3D chiplets, SoIC packaging and CPO. (Silicon-on-Integrated-Chips).-Total rack bandwidth for Feynman to hit 1,000 TB/s versus 260 TB/s for Rubin and 520 TB/s for Rubin Ultra, making CPO vital.-TSMC construction at advanced packaging plants AP7 in Chiayi and AP8 in Tainan are ahead of schedule, and accelerating-SoIC, CoWoS-L and CoPoS are all being pulled forward-SoIC capacity seen at 50,000 wafers-per-month (wpm) by end-2027, vs end-2026's 20,000wpm $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #semiconductorsSource: Dan Nystedt"
datetime: "2026-08-14T01:16:43.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000853957.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000853957.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000853957.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Nvidia’s next generation chip platform, Feynman is…


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**