---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000867250.md"
description: "SK Hynix confirmed it will use Intel’s EMIB advanced packaging for next-gen HBM memory chips, joining Apple, MediaTek and other top TSMC clients in a win for Intel, media report, adding the victory is mainly due to the continued shortage of TSMC’s CoWoS capacity. $SK Hynix(SKHY.US) $Intel(INTC.US) $Taiwan Semiconductor(TSM.US) $Apple(AAPL.US) #semiconductorsSource: Dan Nystedt"
datetime: "2026-08-25T01:06:43.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000867250.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000867250.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000867250.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# SK Hynix confirmed it will use Intel’s EMIB advanc…


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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**