Micron and SanDisk get all the memory headlines but the Intel angle from Hot Chips is more interesting long term. SK Hynix confirmed it's evaluating Intel's EMIB packaging for next gen HBM, mainly to diversify away from being fully dependent on TSMC's CoWoS capacity. This is still R&D stage, not a signed supply deal, so don't expect revenue from it for years. But if it goes anywhere, it's a real signal that Intel Foundry can win credibility from a company that has zero reason to help a rival unless the tech and pricing actually work. INTC is still down over 35 percent from its 2026 high even after this week's news.