---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000871817.md"
description: "Apple’s new M6 laptop/compute chip has continued the use of SoIC-MH advanced packaging, but high-end M-series chips (M6 Pro, Max, Ultra) may use 2 advanced packaging techniques, SoIC-MH for interconnect density and WMCM to integrate logic, LPDDR memory and high-speed I/O, media report, noting TSMC is readying capacity in 3 plants: Zhunan AP6, Longtan AP3 and Chiayi AP7. Analysts estimate WMCM capacity could reach 60,000 wafers-per-month (wpm) by end 2026 and over 120,000wpm in 2027. Important to note that the M6 is a monolithic die – everything on one slab of silicon – while the Pro, Max and Ultra versions are multi-die (chiplets) which need to be ‘stitched’ together via advanced packaging techniques. SoIC-MH: System-on-Integrated-Chips Multi-HeightWMCM: Wafer-Level Multi-Chip Module $Apple(AAPL.US) $Taiwan Semiconductor(TSM.US) #semiconductorsSource: Dan Nystedt"
datetime: "2026-08-27T01:37:01.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000871817.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000871817.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000871817.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Apple’s new M6 laptop/compute chip has continued t…


### Related Stocks

- [AAPL.US](https://longbridge.com/en/quote/AAPL.US.md)
- [TSM.US](https://longbridge.com/en/quote/TSM.US.md)

---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**