---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000873458.md"
description: "Samsung Electronics aims to reach mass production on FOPLP (Fan-out Panel Level Packaging) by 2028, media report, adding its decades of work in display panels mean it’s taking a very different path than TSMC. Both are moving to rectangular shaped substrates – Samsung on 415 x 510 mm panel format, TSMC on 310 x 310 mm – but Samsung’s past work focused on mature chips. It’s expanding the effort to high-performance chips by 2028. TSMC, which calls its offering CoPoS (Chip-on-Panel-on-Substrate), is designed for high-end graphics chips (GPUs), custom ASICs, and other HPC (high-performance computing) chips. $Taiwan Semiconductor(TSM.US) $SSNLF #Samsung #FOPLP #semiconductorsSource: Dan Nystedt"
datetime: "2026-08-27T23:50:11.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000873458.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000873458.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000873458.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Samsung Electronics aims to reach mass production …


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**