Shortages continue for TSMC’s top production processes, 3nm and 2nm, and CoWoS advanced packaging, media report, mostly locked up by Nvidia and Apple. Amazon AWS has won more 3nm capacity recently, while MediaTek continues to seek more 2nm/3nm capacity and CoWoS-S/L packaging for smartphone chips and Google TPUs.
MediaTek is said to be on the short end of capacity allocation from TSMC due to Google’s TPU v9, which will split packaging orders between TSMC's CoWoS-L and Intel's EMIB-T. The MediaTek-assisted 3nm TPU v8t is to enter mass production in the 4th quarter and scale up further in 2027AWS continues to scale up orders for next-gen chips, boosted by partnerships with Alchip, Marvell, Qualcomm.Apple is now TSMC’s chief 2nm customer, for A20 Pro chips used in premium iPhones. Nvidia is the primary 3nm client.TSMC’s 2nm capacity will hit 100,000 wafers-per-month (wpm) by late October, with 50,000 each at Fab 20 in Hsinchu and Fab 22 in Kaohsiung.3nm capacity will reach 185,000wpm by late October.Overflow orders for advanced packaging are mostly expected to go to SiliconWare Precision, part of the ASE Group $Taiwan Semiconductor(TSM.US) $Alphabet(GOOGL.US) $Amazon(AMZN.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $Advanced Semiconductor Engineering(ASX.US)Source: Dan Nystedt
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