---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000955702.md"
description: "TSMC plans to hike CoWoS advanced packaging prices another 20% as demand for AI chips continues to rise and demand for advanced packaging extends to other types of chips, media report, citing unnamed supply chain sources. Delivery times (lead times) have already been extended due to capacity constraints – and competition is making the the situation worse as rivals vie for production line machinery. Equipment delivery times are now up to 8-months, vs 3 – 6-months previously, and prices are rising. Investment bankers estimate TSMC’s monthly CoWoS capacity will exceed 130,000 wafers per month (wpm) this year and 200,000wpm in 2027. $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $Amkor Tech(AMKR.US) $Advanced Semiconductor Engineering(ASX.US) #semiconductorsSource: Dan Nystedt"
datetime: "2026-10-27T00:05:12.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000955702.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000955702.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000955702.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC plans to hike CoWoS advanced packaging prices…


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**