Samsung Chairman Lee Jae-yong made his first visit to the company's advanced semiconductor packaging R&D lab in Yoko…
Samsung Chairman Lee Jae-yong made his first visit to the company's advanced semiconductor packaging R&D lab in Yokohama, Japan on Sunday (11/1), media report, adding the lab, which opened in September, is aimed at boosting Samsung’s AI chip packaging prowess by working more closely with Japanese suppliers of materials, parts and equipment. Samsung plans to continue hiring local researchers for the lab. #Samsung #semiconductors
Source: Dan Nystedt
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