---
title: "The three major DRAM manufacturers are all expanding the production of HBM (High Bandwidth Memory) c"
description: "The three major DRAM manufacturers are all expanding the production of HBM (High Bandwidth Memory) chips (AI memory), which has prompted Applied Materials to urgently increase its production capacity."
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/21979179.md"
published_at: "2024-06-21T03:04:32.000Z"
author: "[叮当 Pro](https://longbridge.com/en/profiles/9231891)"
---

# The three major DRAM manufacturers are all expanding the production of HBM (High Bandwidth Memory) c

The three major DRAM manufacturers are all expanding the production of HBM (High Bandwidth Memory) chips (AI memory), which has prompted Applied Materials to urgently increase its production capacity. Orders from Applied Materials have already filled the factories of its Taiwanese contract manufacturing partner, Foxsemicon, until the second quarter of next year, and the order intensity is expected to continue until 2025.$Applied Materials(AMAT.US)$Micron Tech(MU.US)

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- [AMAT.US - Applied Materials](https://longbridge.com/en/quote/AMAT.US.md)
- [MU.US - Micron Tech](https://longbridge.com/en/quote/MU.US.md)
- [002818.CN - FSM](https://longbridge.com/en/quote/002818.CN.md)

---

> **Disclaimer**: This article is for reference only and does not constitute any investment advice.