---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/39987362.md"
description: "Forward:$Taiwan Semiconductor(TSM.US)'s advanced packaging capacity has reached its limit.$Intel(INTC.US) Intel's advanced packaging business is gaining attention as an alternative to TSMC, especially in the field of AI chips.Google and Amazon are actively discussing advanced packaging services with Intel for their custom ASICs, potentially adopting Intel's EMIB or next-generation EMIB T technology for Google's TPU and Amazon's Trainium chips.Customer commitments for these packaging deals are expected to be reached in the second half of 2026, with possible updates during Intel's earnings call on April 23.Intel CFO David Zinsner noted that customers are ready to commit, even with prepayments, and these potential deals could reach billions of dollars. He described advanced packaging as a more interesting and profitable part of the foundry business today, with gross margins around 40%.This interest stems mainly from TSMC's constrained advanced packaging capacity, which remains highly concentrated in Taiwan, raising supply chain security concerns for hyperscale cloud providers.Intel is actively expanding its packaging capacity, including a new complex in Malaysia scheduled to begin operations in 2026 for assembly and testing, and its New Mexico facility has begun mass production of advanced 3D packaging since early 2024.EMIB T is an upgraded version of Intel's Embedded Multi-die Interconnect Bridge technology, adding through-silicon vias to improve power delivery and signal integrity, and is designed to support very large AI packages.TSMC's response is to build its own advanced packaging plant in the US, with construction set to begin in Q2 2026 and operations targeted for late 2027 to 2028.This development highlights the growing momentum of Intel's foundry business turnaround, leveraging its packaging strengths to attract major AI clients amid tight industry capacity."
datetime: "2026-04-17T05:04:16.000Z"
locales:
  - [en](https://longbridge.com/en/topics/39987362.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/39987362.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/39987362.md)
author: "[和伟大同行](https://longbridge.com/en/profiles/9681606.md)"
---

# Forward:$Taiwan Semiconductor(TSM.US)'s advanced p…


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