---
title: "A Guide to CPO Test Process Equipment Suppliers"
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/40051823.md"
description: "I. The overall framework of the CPO (Co-Packaged Optics) testing process is divided into 4 stages. Each stage lists mainstream vendors according to 4 categories: "Probe Station/Assembly Equipment, ATE Host, Optoelectronic Measurement Instruments, Other Key Suppliers." This fully covers the entire chain from chip-level verification to final system reliability testing. II. Core Information of Each Stage First Paragraph: EIC/PIC Chip-Level Testing Core Objective: Conduct wafer-level/bare-die-level basic verification for electrical chips (EIC) and photonic chips (PIC)..."
datetime: "2026-04-21T01:24:23.000Z"
locales:
  - [en](https://longbridge.com/en/topics/40051823.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/40051823.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/40051823.md)
author: "[谈风论水](https://longbridge.com/en/profiles/14964496.md)"
---

# A Guide to CPO Test Process Equipment Suppliers

I. Overall Framework

The CPO (Co-Packaged Optics) testing process is divided into 4 stages. Each stage categorizes mainstream vendors into 4 types: "Probe Station/Assembly Equipment, ATE Host, Optoelectronic Measurement Instruments, Other Key Suppliers," fully covering the entire chain from chip-level verification to final system reliability testing.

II. Core Information for Each Stage

1.  Stage 1: EIC/PIC Chip-Level Testing

-   Core Objective: Perform wafer-level/die-level basic verification for electrical chips (EIC) and photonic chips (PIC).
-   Key Vendors: - Probe Station/Assembly Equipment: FormFactor (FORM.NASDAQ$Formfactor(FORM.US) ), MPI (non-listed), ficonTEC (acquired by Robotec$RoboTechnik(300757.SZ) , not separately listed)
-   ATE Host: Advantest (6857.T), Teradyne (TER.NASDAQ$Teradyne(TER.US) ) (two major industry giants)
-   Optoelectronic Instruments: Keysight (KEYS.NYSE$Keysight Tech(KEYS.US) ), Anritsu (6754.T), Tektronix (acquired by Fortive, not separately listed) (leaders in high-end oscilloscopes, bit error rate testers)
-   Others: Onto Innovation (ONTO.NYSE$Onto Innovation(ONTO.US) ), Enlitech (non-listed), EXFO (EXF.TSX), etc.

1.  Stage 2: Coupler/FAU Coupling and Assembly Testing

-   Core Objective: Complete the assembly and performance verification of optical couplers (Coupler) and fiber access units (FAU), a key link in the optical path connection.
-   Key Vendors: - Probe Station/Assembly Equipment: ficonTEC (acquired by Robotec, not separately listed), Palomar (PLMR.NASDAQ$Palomar(PLMR.US) ), MR (non-listed), Finetech (non-listed) (high-precision placement/coupling equipment manufacturers)
-   ATE Host: PI (non-listed), Aerotech (non-listed), Newport/MKS (MKS Instruments, MKSI.NASDAQ$MKS(MKSI.US) ) (precision motion control/positioning system suppliers)
-   Optoelectronic Instruments: Santec (6777.T), VIAVI (VIAV.NASDAQ$Viavi Solutions(VIAV.US) ), Quantifi Photonics (non-listed, acquired by Teradyne$Teradyne(TER.US) ), Luna (non-listed) (optical device testing instruments)
-   Others: Corning (GLW.NYSE$Corning(GLW.US) ), SENKO (9069.T), US Conec (non-listed) (fiber optic connector/passive device manufacturers)

1.  Stage 3: OE Optical Engine Testing

-   Core Objective: Perform overall performance verification of the optical engine (OE) module, the core stage of CPO functional testing.
-   Key Vendors: - Probe Station/Assembly Equipment: Advantest (6857.T), Teradyne (TER.NASDAQ) (ATE solutions integrated with optical engine functional testing)
-   ATE Host: Keysight (KEYS.NYSE), Anritsu (6754.T) (high-speed optoelectronic test platforms)
-   Optoelectronic Instruments: Tektronix (acquired by Fortive, not separately listed), Teledyne LeCroy (Teledyne, TDY.NYSE$Teledyne Tech(TDY.US) ), Yokogawa (6841.T) (high-speed signal and optical performance testing)
-   Others: Chroma ATE (2360.TWSE) (burn-in/reliability test equipment)

1.  Stage 4: SALT System-Level Reliability Testing

-   Core Objective: Complete system-level long-term reliability verification (including LIV testing, thermal testing, environmental testing, etc.) to ensure long-term stable operation of the product.
-   Key Vendors: - Probe Station/Assembly Equipment: ficonTEC (acquired by Robotec, not separately listed) (assembly lines integrated with LIV testing)
-   ATE Host: Keysight (KEYS.NYSE), Artifex Engineering (non-listed), Instrument Systems (acquired by Konica Minolta, not separately listed), Electron Test (non-listed) (LIV/system-level test platforms)
-   Optoelectronic Instruments: Quantifi Photonics (non-listed, acquired by Teradyne), Yokogawa (6841.T) (laser performance, optical signal testing)
-   Others: Siemens (SIEM.XETRA), ESPEC (6859.T), Thermotron (non-listed), Chroma ATE (2360.TWSE) (thermal testing, environmental test chambers, burn-in test equipment

III. Core Trend Summary

1\. High concentration of leading vendors: International giants like Advantest, Teradyne, Keysight, Anritsu, and Tektronix are almost involved in the core testing links throughout the entire process, especially in the ATE host and high-end optoelectronic instrument fields.  
2\. Each niche has its leader: Vendors like ficonTEC, FormFactor, and MPI dominate the probe station/assembly equipment field, while Corning, SENKO, etc., focus on passive devices and fiber optic connection solutions.  
3\. Progressive testing stages: From chip-level, device-level, to module-level, and system-level, testing complexity gradually increases. Equipment also evolves from single-function verification towards integrated, multi-parameter synchronous testing platform solutions.

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