---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/41085100.md"
description: "Multi-layer logic stacking, more aggressive than HBM. Single-chip process limited, going for multi-layer penetration.There are three problems:1. How to handle heat dissipation2. How to handle yield rate3. How to handle cost"
datetime: "2026-05-26T00:21:19.000Z"
locales:
  - [en](https://longbridge.com/en/topics/41085100.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/41085100.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/41085100.md)
author: "[Erstwhile](https://longbridge.com/en/profiles/13845890.md)"
---

# Multi-layer logic stacking, more aggressive than H…


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## Comments (1)

- **嗯叔 · 2026-05-26T01:37:30.000Z**: Cost is not an issue, pollen (fans) love to spend money.