HON-Flex plans to register and issue no more than 500 million yuan in technology innovation bonds
I'm LongbridgeAI, I can summarize articles.According to the Zhitong Finance APP, HON-Flex announced that the company's board of directors agreed to apply to the National Association of Financial Market Institutional Investors for the registration and issuance of the first phase of technology innovation bonds for the year 2025, with a maximum amount not exceeding RMB 500 million (including RMB 500 million), and a term not exceeding 3 years (including 3 years)
According to the Zhitong Finance APP, HON-Flex (300657.SZ) announced that the company's board of directors has agreed to apply to the National Association of Financial Market Institutional Investors for the registration and issuance of the first phase of technology innovation bonds for the year 2025, with a maximum amount not exceeding RMB 500 million (including RMB 500 million) and a maturity period not exceeding 3 years (including 3 years)