---
title: "To acquire controlling interest in IC product distributor Sunlord Electronics, Sunlord Electronics plans to issue convertible bonds not exceeding 1 billion yuan"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/257351303.md"
description: "Sunlord Electronics plans to issue no more than 1 billion yuan in convertible bonds, with the raised funds to be used for acquiring 88.79% of the equity of Ligon Technology, with a transaction price of 709 million yuan. Ligon Technology mainly distributes MCU chips and other IC products, representing well-known brands such as NXP. This acquisition will make Ligon Technology a subsidiary controlled by Sunlord Electronics, enhancing its market competitiveness in the fields of industrial intelligent IoT and automotive electronics"
datetime: "2025-09-15T11:13:02.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/257351303.md)
  - [en](https://longbridge.com/en/news/257351303.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/257351303.md)
generator: "portal-rs"
---

# To acquire controlling interest in IC product distributor Sunlord Electronics, Sunlord Electronics plans to issue convertible bonds not exceeding 1 billion yuan

According to the announcement from Sunlord Electronics (300975.SZ), the company plans to issue convertible corporate bonds to unspecified objects, with the total amount of funds raised not exceeding 1 billion yuan (inclusive). After deducting issuance costs, the raised funds are intended to be used entirely for the acquisition of equity in Ligon Technology and to supplement working capital.

Regarding the acquisition of equity in Ligon Technology, the company intends for its wholly-owned subsidiary Changying Holdings (Nanjing) Co., Ltd. (referred to as "Changying Holdings") to acquire a total of 88.79% equity in Guangzhou Ligon Technology Co., Ltd. (referred to as "Ligon Technology") through direct and indirect means, in order to achieve actual control over the target company. Upon completion of the transaction, Ligon Technology will become a controlling subsidiary of the company. The transaction price is set at 709 million yuan, with an adjustment cap not exceeding 133 million yuan.

The funding for the transaction will come from the listed company's own funds and funds raised through external financing methods. The company plans to use 700 million yuan of the funds raised through the issuance of convertible corporate bonds to pay for this acquisition; however, the success of the transaction is not contingent upon the successful implementation of the raised funds from the convertible corporate bonds.

The announcement indicates that Ligon Technology primarily focuses on authorized distribution of various IC products such as MCU chips, driver chips, and memory chips for users in the industrial intelligent IoT and automotive electronics fields. Ligon Technology mainly represents well-known chip brands including NXP, ISSI, 3PEAK, Rockchip, GigaDevice, and Fudan Microelectronics. NXP is one of the core product lines authorized by Ligon Technology, which began promoting MCU and other products from Philips Semiconductor Division (the predecessor of NXP) in China at its inception. After NXP became independent from Philips, Ligon Technology became an authorized distributor for NXP and is one of NXP's main MCU distributors. NXP has a strong comprehensive competitive advantage in the global automotive electronics chip field. Additionally, the authorized agency qualifications held by Ligon Technology, including Fudan Microelectronics, Rockchip, and ISSI, can also form strong complementarity and business synergy with the company's existing business and product categories.

After the transaction is completed, by integrating the authorized agency qualifications of both parties from well-known original manufacturers at home and abroad, the company can further enrich its distribution product portfolio and transform the competitiveness of the original manufacturers into the overall competitiveness of the company, continuously expanding the downstream mid-to-high-end product market, meeting customer needs for one-stop procurement, comprehensively reducing overall procurement costs, enhancing the cooperation stickiness between original manufacturers, customers, and the company, and improving the company's market competitiveness and profitability

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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**