---
title: "The liquid cooling track continues to heat up as multiple companies make deep investments"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/257607884.md"
description: "On September 16th, liquid cooling concept stocks performed strongly, with several companies such as Tricolor, YINLUN, and LOPAL hitting the daily limit. NVIDIA is promoting the development of microchannel water cooling plates to address the heat generated by AI GPU chips, with prices 3-5 times higher than existing solutions. China International Capital Corporation (CICC) believes that the updates and applications of AI large models will increase computing power demand, and liquid cooling will accelerate the replacement of air cooling, with the global AI liquid cooling market expected to reach USD 8.6 billion by 2026"
datetime: "2025-09-16T20:34:34.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/257607884.md)
  - [en](https://longbridge.com/en/news/257607884.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/257607884.md)
generator: "portal-rs"
---

# The liquid cooling track continues to heat up as multiple companies make deep investments

On September 16th, liquid cooling concept stocks strengthened, with Tricolor, YINLUN, and LOPAL hitting the daily limit, and Runhe Materials rising over 14%. In terms of news, NVIDIA is pushing upstream suppliers to develop a type of water cooling component called microchannel cold plates to address the increasing heat generated by AI GPU chips with each generational upgrade, with a unit price three to five times that of existing cooling solutions. It is reported that the unit price of MLCP can reach 3-5 times that of traditional cold plates and can contribute to higher gross margins, but due to its complexity in fluid dynamics and bubble dynamics, as well as a higher risk of coolant leakage, it will take some time to mature. According to a research report from China International Capital Corporation, the iterative updates of AI large models and the implementation of applications are driving the demand for computing power, with chip power consumption and computing density continuing to rise. Liquid cooling, with its advantages in cooling efficiency and deployment density, is accelerating its replacement of air cooling and gradually becoming the mainstream solution. The global AI liquid cooling market is expected to reach USD 8.6 billion by 2026, achieving rapid market growth; cold plate liquid cooling is expected to scale up first

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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**