
SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer | SHMD Stock News

SCHMID Group successfully delivered and installed its InfinityLine C+ system to a leading Japanese customer in advanced packaging. This next-gen technology offers touch-free operation, single-panel processing, and full automation, enhancing SCHMID's leadership in Panel Level Packaging and high-density substrate manufacturing. The system supports high-density interconnect applications, providing maximum yield and minimal contamination. SCHMID is now entering the commercialization phase, offering demonstrations and integrations. The InfinityLine C+ complements SCHMID's existing platforms, providing a modular process ecosystem for substrate and PLP manufacturers.
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