<div id="readability-page-1"><div>//php echo do_shortcode('[responsivevoice_button voice=&#34;US English Male&#34; buttontext=&#34;Listen to Post&#34;]') ?&gt; The inaugural PCIM Asia New Delhi Conference brought industry and academic engineering communities together for two days of discussions on power electronics research, design and manufacturing.Exhibitors and researchers highlighted new silicon carbide (SiC) module families, evolving converter architectures and the engineering gaps that still need to be closed for wider SiC adoption in rail, automotive, industrial and grid applications. The conference was supported by the Ministry of Electronics and IT (MeitY), the Ministry of Power, iNEMI and IPCA.Speaking at the opening session, Sunita Verma, Group Coordinator (R&amp;D) and Joint Secretary at MeitY, said the government continues to support research activity in this sector. “MeitY has been funding research in the power electronics industry for a long time,” Verma said. She added that the government is evaluating fabrication proposals in SiC under India’s semiconductor mission. “There is a huge scope for made-in-India power electronics, circuits, devices, materials and systems,” she said, adding that policy and fiscal support are already in place to encourage this work. Verma said the government expects demand for power electronics to rise domestically and internationally, and highlighted opportunities for collaboration between public institutions, researchers and companies developing hardware for applications like mobility, renewable systems and industrial equipment. The conference program included sessions on system-level design, device technologies and manufacturing, along with structured interactions between industry and academia. Student mentoring activities and poster presentations were also part of the event, aimed at supporting emerging researchers.EE Times spoke to various exhibitors at the event to understand current priorities for device development, converter design and system engineering, as well as the challenges companies see in the transition to next-generation materials and architectures.Device manufacturers brought new SiC module families to the show. Mitsubishi Electric India displayed traction-grade SiC modules for rail and automotive platforms. Talking about the SiC devices for railways showcased at the exhibition, Hitesh Bhardwaj, general manager and business head of semiconductors and devices at Mitsubishi Electric India said, “This is the first time Mitsubishi Electric has designed an 800 A, 3.3 kV device.”Bhardwaj added that newer device ratings were enabling changes in locomotive converter architecture. “Now we have the 1000 A, 4.5 kV device, which is sufficient to run these motors,” he said, highlighting that higher current density means “the size of the converter is also being reduced.”Clas-SiC Wafer Fab, a SiC wafer supplier based in the U.K., said interest in wide-bandgap materials in India is still emerging. EE Times spoke to Jennifer Walls, CEO of Clas-SiC, who said, “It is not an established or nearly established market. They are just hearing about silicon carbide.”Walls added that global demand for their products is led by China. “China followed by Taiwan, North America, then Europe …. recently we have had new customers in South America and Australia.”Component suppliers also used the event to highlight gaps in domestic manufacturing. Viz, a Hyderabad-based capacitor manufacturer, showcased heavy-duty capacitors for railway applications. Business development manager Arun Kumar explained the scale difference between consumer and locomotive capacitors. “Your fan uses a 2.5 microfarad capacitor. This [pointing to Viz’s product display] is 21,000 to 25,000 microfarads because it is used for a locomotive.”The company operates two plants in Hyderabad and supplies several branded system manufacturers, claiming that “India’s largest-selling capacitor is ours.”MacDermid Alpha Electronics Solutions, a materials supplier, said it recorded a steady increase in interest from domestic companies, with the Indian market being a large focus area. “We are the largest electronic assembly materials supplier in India. And globally as well,” said Ravi M. Bhatkal, VP of strategy at MacDermid Alpha Electronics Solutions. “We have been manufacturing in India for 94 years and helped build the electronics industry in India. My team has trained about 11,000 engineers in the field.”Bhatkal said the company works across the complete substrate and assembly chain. “Our materials are now used in high-volume production globally for electric vehicles and traction and other applications. Anywhere an electron goes or heat goes, we make that.”Several Indian academic groups showcased converter and system-level prototypes at the event. Researchers from IIT Delhi’s Electrified Lab displayed SiC modules developed for applications like charging stations and high-voltage, direct-current systems.“We are working on power electronic converters for various applications, for high-power as well as consumer-level appliances,” said Abhrodip Chaudhary, a research scholar from the Electrified Lab.The group is seeking external collaboration, adding, “We feel that these converters have many advantages over existing systems …. if they are brought out as a product, they will have a good market.”IIT Bombay’s power electronics and electric-vehicle group highlighted its solid-state transformer research. The team said it is in discussions with industry partners regarding ongoing work at the “electric vehicle powertrain lab.”The conference marked one of the first large-scale gatherings of the domestic power electronics community, bringing together semiconductor firms, materials suppliers, system designers, researchers and end-user industries. The consensus among attendees was optimistic about growth in the Indian market as mobility, grid modernization and renewable installations expand. However, optimism was tempered with concerns about the need for design collaboration and a steady supply chain for SiC and high-voltage converter technologies to move toward commercial deployment. </div></div>

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The inaugural PCIM Asia New Delhi Conference focused on power electronics, highlighting new SiC module families and converter designs. Supported by Indian government bodies, the event emphasized research and manufacturing in SiC for rail, automotive, and industrial applications. Key discussions included engineering challenges, domestic manufacturing gaps, and global market trends. Exhibitors like Mitsubishi Electric and Clas-SiC showcased innovations, while Indian academic groups presented prototypes. The conference underscored collaboration opportunities and the growing demand for power electronics.

SiC Modules, Converter Designs Come into Focus at PCIM India Debut