--- title: "Hymson Laser Technology TGV has sent samples to multiple companies: positioning itself in advanced packaging, anchoring the new blue ocean of AI computing power" type: "News" locale: "en" url: "https://longbridge.com/en/news/288997175.md" description: "Hymson Laser Technology disclosed that its TGV technology has been sampled to multiple packaging factories, panel manufacturers, and upstream enterprises, clarifying the industrialization path for advanced glass-based packaging and display fields. The company relies on its self-developed capabilities in the entire chain of laser + etching, achieving core indicators that reach the highest level of global mass production, and has been certified by leading computing power giants in North America, aiming to penetrate the top global supply chain and seize market opportunities brought by AI computing power" datetime: "2026-06-08T03:40:41.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/288997175.md) - [en](https://longbridge.com/en/news/288997175.md) - [zh-HK](https://longbridge.com/zh-HK/news/288997175.md) generator: "portal-rs" --- # Hymson Laser Technology TGV has sent samples to multiple companies: positioning itself in advanced packaging, anchoring the new blue ocean of AI computing power Recently, Hymson Laser Technology (688559) disclosed on the investor interaction platform that the company's TGV (Through Glass Via) technology has been sampled and matched with packaging factories, panel manufacturers, and upstream enterprises in the industry chain. This progress clarifies the company's dual industrialization path in the fields of glass-based advanced packaging and display, directly addressing the core demand for AI computing power and opening up new performance growth opportunities. TGV, as the core processing technology for glass substrates, is key to breaking through the bottleneck of high-end AI chip packaging. Currently, the explosive growth of AI computing power is pushing traditional ABF organic substrates to their limits in thermal stability and wiring density, while glass substrates, with advantages such as low dielectric loss and high thermal stability, have become the new generation base for advanced packaging. Hymson Laser Technology has broken the overseas monopoly on high-end drilling equipment with its self-developed core barriers in the laser + etching full chain. The minimum aperture of the company's TGV glass vias is ≤3μm, and the yield rate of through holes for the entire wafer is ≥98.5%. The core indicators have reached the highest level of global mass production, making it the only equipment manufacturer in China with this full chain capability. The sampled clients include packaging factories, panel manufacturers, and their upstream industry chain, with the inclusion of panel manufacturers being particularly crucial—glass substrate technology has a common origin in the processes of display panels and advanced packaging. The crossover of panel companies into packaging has become a distinct feature of the AI materials revolution (BOE has advanced its glass-based packaging business line, and TCL Technology is also maintaining a high level of attention). This client structure fully reflects the cross-industry versatility of TGV technology and validates Hymson's capability transfer from the display field to the packaging field. In addition, the company has achieved a post-repair yield of 99.999% in the MicroLED mass transfer field, and the first pilot line has successfully shipped, covering all aspects of transfer, welding, and laser repair, laying the foundation for the synergy of TGV in both display and packaging tracks. Based on industry development trends, Hymson Laser Technology has clarified its strategic focus, concentrating on deepening the core tracks of glass and ABF-based substrates while continuously expanding the frontier applications of AI computing power in lasers. Currently, Hymson has obtained certification from leading computing giants in North America, successfully entering the top global supply chain. From an industry cycle perspective, 2026 is viewed as the year of commercialization for glass substrates, with global tech giants like TSMC and Intel ramping up their investments, indicating a broad growth space in the industry. It is expected that by 2028, the global market size will exceed $10 billion. As a core target for TGV equipment in China, with the delivery of the pilot line and the advancement of sample verification, Hymson's TGV business is expected to enter a period of significant growth in the second half of 2026, forming synergies with the company's existing AI computing power businesses such as liquid cooling plates and high-speed connectors, establishing a new performance growth pole. Industry insiders analyze that Hymson's proactive disclosure of the multidimensionality of its sampled client structure is an important signal of quantifying technological advantages into industrial ecological advantages. The company is strategically upgrading from a traditional equipment supplier to a core equipment provider in the AI computing power industry chain, and deep connections and validations with leading clients across multiple fields will lay a solid foundation for the company to seize the domestic substitution dividends of advanced packaging and consolidate its first-mover advantage in the industry ### Related Stocks - [688559.CN](https://longbridge.com/en/quote/688559.CN.md) - [000725.CN](https://longbridge.com/en/quote/000725.CN.md) - [000100.CN](https://longbridge.com/en/quote/000100.CN.md) - [TSM.US](https://longbridge.com/en/quote/TSM.US.md) - [INTC.US](https://longbridge.com/en/quote/INTC.US.md) - [200725.CN](https://longbridge.com/en/quote/200725.CN.md) ## Related News & Research - [3 arguments for and against AI watermarks](https://longbridge.com/en/news/296205500.md) - [The hottest AI models aren’t the ones developers actually use](https://longbridge.com/en/news/296083842.md) - [Argentum AI Announces $10 Billion+ in Contracted Revenue and Targets 1GW of AI Infrastructure Capacity in 2026](https://longbridge.com/en/news/296261035.md) - [The push for AI watermarks is spawning a new wave of tools to remove them](https://longbridge.com/en/news/296262434.md) - [Chamath Palihapitiya says data center backlash is a 'powder keg' that AI leaders must defuse](https://longbridge.com/en/news/296516595.md) --- > **Disclaimer: This article is for reference only and does not constitute any investment advice.**