---
title: "LENS  Signs MOU With Intel Corporation  on Advanced Through-Glass Via Packaging Technology Cooperation"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/293869786.md"
description: "LENSannounced that its subsidiary signed an MOU with Intel to explore cooperation on advanced through-glass via (TGV) packaging technologies. The collaboration will cover glass substrate processing, laser processing, and metallization, as well as potential applications in AI PCs, data center servers, and robotics. The one-year MOU excludes transaction commitments. LENS highlighted its existing TGV expertise, pilot lines, and ongoing customer validation."
datetime: "2026-07-27T02:19:21.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/293869786.md)
  - [en](https://longbridge.com/en/news/293869786.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/293869786.md)
---

# LENS  Signs MOU With Intel Corporation  on Advanced Through-Glass Via Packaging Technology Cooperation

LENS (06613.HK) \-0.200 (-0.915%) Short selling $27.20M; Ratio 6.430% announced that its wholly-owned subsidiary Lens International (Hong Kong) recently signed a memorandum of cooperation with Intel Corporation (INTC.US) . The two parties will explore potential cooperation on through-glass via (TGV) advanced packaging technologies, and will discuss and evaluate key process-related areas including glass substrate drilling and forming, high-precision laser processing, metallized via deposition, and multilayer interconnect routing.

The two parties also believe there is potential for collaboration in complementary areas including AI PC structural components and modules, highly reliable structural and thermal dissipation components for data center servers, as well as embodied AI robots, industrial intelligent equipment, and edge computing hardware. Except for clauses related to intellectual property rights and confidentiality, other terms of the memorandum do not constitute transaction commitments and will remain valid for one year.

LENS stated that the company has accumulated long-term technological expertise in TGV precision processing, micro-hole forming, metallized deposition, and multilayer interconnect processes. It has established relevant pilot production lines and commenced sample trial production. Samples have already been delivered to certain potential customers for evaluation, while some customers have completed initial proof-of-concept validation and entered the technical testing stage. (gc/u)(HK stocks quote is delayed for at least 15 mins.Short Selling Data as at 2026-07-24 16:25.) (Real-time Streaming US Stocks Quote; Except All OTC quotes are at least 15 minutes delayed.)

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