--- title: "TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance" type: "News" locale: "en" url: "https://longbridge.com/en/news/294487415.md" description: "TSMC is reportedly developing an advanced chip packaging technology similar to Intel's EMIB, potentially challenging Intel's competitive edge. This development comes as Nvidia evaluates Intel's EMIB for future processors. TSMC currently utilizes CoWoS technology for AI chips but plans to expand its capabilities. The move could threaten Intel Foundry's advantage in advanced packaging." datetime: "2026-07-31T08:54:58.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/294487415.md) - [en](https://longbridge.com/en/news/294487415.md) - [zh-HK](https://longbridge.com/zh-HK/news/294487415.md) --- # TSMC Is Reportedly Developing Advanced Chip Packaging Tech to Challenge Intel's Dominance **Taiwan Semiconductor Manufacturing Co.** (NYSE:TSM) is reportedly developing an advanced packaging technology, which could erode **Intel Corp.**‘s (NASDAQ:INTEL) competitive advantage. Intel’s stock is trading 4.62% higher in Friday’s pre-market trading session, while TSMC stock is trading 3.69% higher. TSMC is reportedly developing a chip packaging technology similar to Intel’s Embedded Multi-die Interconnect Bridge (EMIB), internally called “EMIB Like,” and is partnering with Taiwan’s **Kinsus Interconnect Technology** on the project, according to The Information on Thursday. The report also said **Nvidia Corp.** (NASDAQ:NVDA) is evaluating Intel’s EMIB packaging technology for a future processor. TSMC, Intel and Nvidia did not immediately respond to Benzinga’s request for comments. **Read Also: Samsung, Broadcom Ink $200 Billion AI Chip Pact Through 2030 as Foundry Race With TSMC Heats Up** ## **AI Chip Packaging Battle Grows** Intel has positioned EMIB as an advanced packaging technology that uses silicon bridges to connect multiple chip components, enabling larger, more complex processors while improving efficiency and reducing manufacturing costs. Meanwhile, TSMC currently uses its advanced CoWoS (Chip-on-Wafer-on-Substrate) packaging technology to produce AI chips for major customers, including Nvidia and **Advanced Micro Devices Inc.** (NASDAQ:AMD). In April, TSMC announced plans to expand its CoWoS advanced packaging technology with a 14-reticle package, slated for production in 2028, capable of integrating approximately 10 large compute dies and 20 HBM stacks. If TSMC launches an EMIB-like packaging technology, it could pose a threat to the key factor that gave Intel Foundry an edge. The report also comes days after Intel announced a strategic partnership with China’s **Lens Technology** to develop glass substrate-based advanced semiconductor packaging for future AI and data center chips. **_Disclaimer_:** _This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors_. _Image via Shutterstock_ **Read Also: Intel Gives Little-Known Stealth Startup Access to Atom Chip Technology in Deal Linked to CEO Lip-Bu Tan’s Former Business Partner: Report** ### Related Stocks - [INTC.US](https://longbridge.com/en/quote/INTC.US.md) - [NVDS.US](https://longbridge.com/en/quote/NVDS.US.md) - [NVDQ.US](https://longbridge.com/en/quote/NVDQ.US.md) - [NVDY.US](https://longbridge.com/en/quote/NVDY.US.md) - [INTW.US](https://longbridge.com/en/quote/INTW.US.md) - [NVDU.US](https://longbridge.com/en/quote/NVDU.US.md) - [NVD.US](https://longbridge.com/en/quote/NVD.US.md) - [04335.HK](https://longbridge.com/en/quote/04335.HK.md) - [07788.HK](https://longbridge.com/en/quote/07788.HK.md) - [07388.HK](https://longbridge.com/en/quote/07388.HK.md) - [NVDA.US](https://longbridge.com/en/quote/NVDA.US.md) - [NVDL.US](https://longbridge.com/en/quote/NVDL.US.md) - [NVDD.US](https://longbridge.com/en/quote/NVDD.US.md) - [NVDX.US](https://longbridge.com/en/quote/NVDX.US.md) - [NVDB.US](https://longbridge.com/en/quote/NVDB.US.md) - [NVDG.US](https://longbridge.com/en/quote/NVDG.US.md) - [NVDO.US](https://longbridge.com/en/quote/NVDO.US.md) - [NVDW.US](https://longbridge.com/en/quote/NVDW.US.md) - [NVYY.US](https://longbridge.com/en/quote/NVYY.US.md) - [NYYY.US](https://longbridge.com/en/quote/NYYY.US.md) - [DIPS.US](https://longbridge.com/en/quote/DIPS.US.md) - [MAGX.US](https://longbridge.com/en/quote/MAGX.US.md) - [LINT.US](https://longbridge.com/en/quote/LINT.US.md) - [INYY.US](https://longbridge.com/en/quote/INYY.US.md) - [SMH.US](https://longbridge.com/en/quote/SMH.US.md) - [SOXX.US](https://longbridge.com/en/quote/SOXX.US.md) - [SOXL.US](https://longbridge.com/en/quote/SOXL.US.md) - [SOXQ.US](https://longbridge.com/en/quote/SOXQ.US.md) - [XSD.US](https://longbridge.com/en/quote/XSD.US.md) - [PSI.US](https://longbridge.com/en/quote/PSI.US.md) - [FTXL.US](https://longbridge.com/en/quote/FTXL.US.md) - [09388.HK](https://longbridge.com/en/quote/09388.HK.md) - [TSM.US](https://longbridge.com/en/quote/TSM.US.md) - [002330.CN](https://longbridge.com/en/quote/002330.CN.md) - [03189.HK](https://longbridge.com/en/quote/03189.HK.md) - [05930.HK](https://longbridge.com/en/quote/05930.HK.md) - [SSNGY.US](https://longbridge.com/en/quote/SSNGY.US.md) - [AVGO.US](https://longbridge.com/en/quote/AVGO.US.md) - [AMD.US](https://longbridge.com/en/quote/AMD.US.md) - [300433.CN](https://longbridge.com/en/quote/300433.CN.md) - [06613.HK](https://longbridge.com/en/quote/06613.HK.md) - [NVD.DE](https://longbridge.com/en/quote/NVD.DE.md) - [SMSN.UK](https://longbridge.com/en/quote/SMSN.UK.md) ## Related News & Research - [TSMC CoWoS Yield Tops 98% for Some Lines, Targets 14x Reticle Size by 2029](https://longbridge.com/en/news/295733315.md) - [Nvidia's Next AI Infrastructure Bet Is Scaling Fast](https://longbridge.com/en/news/296144236.md) - [Nvidia’s Best Customers Have a Reason to Stop Buying So Many Nvidia Chips](https://longbridge.com/en/news/295572288.md) - [NVDA Stock Alert: Nvidia CEO Jensen Huang Says Chips Are ‘Investable Asset Class’](https://longbridge.com/en/news/296001978.md) - [Whittier Trust Co. of Nevada Inc. 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