---
title: "MediaTek confirms the introduction of Intel EMIB-T for ASIC packaging"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/294628815.md"
description: "MediaTek confirmed at its latest earnings call that in the AI ASIC project, in addition to using TSMC's CoWoS packaging, it is also simultaneously introducing Intel's EMIB-T advanced packaging technology, indicating that the company's packaging strategy is moving towards diversification to meet the large AI chip design needs of different customers"
datetime: "2026-08-03T02:03:57.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/294628815.md)
  - [en](https://longbridge.com/en/news/294628815.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/294628815.md)
---

# MediaTek confirms the introduction of Intel EMIB-T for ASIC packaging

MediaTek confirmed at its latest earnings call that in the AI ASIC project, in addition to using TSMC's CoWoS packaging, it is also simultaneously introducing Intel's EMIB-T advanced packaging technology, indicating that the company's packaging strategy is moving towards diversification to meet the large AI chip design needs of different customers

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