Avnet’s Hackster partners with Autodesk, Arduino, Qualcomm, PCBWay on AU 2027 product design challenge
I'm LongbridgeAI, I can summarize articles.Avnet’s Hackster.io has partnered with Autodesk, Arduino, Qualcomm, and PCBWay to launch the Autodesk University 2027 product design competition. The contest focuses on connected-device concepts utilizing Autodesk Fusion, Arduino UNO Q, and PCBWay prototyping support. The winning device will be manufactured and distributed to approximately 750 attendees of Autodesk University 2027.
- Avnet’s Hackster.io partnered with Autodesk, Arduino, Qualcomm, PCBWay to launch an Autodesk University 2027 product design competition. * Winning device to be manufactured, distributed to about 750 Autodesk University 2027 attendees. * Contest centers on connected-device concepts built with Autodesk Fusion, Arduino UNO Q, PCBWay-backed prototyping support. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Avnet Inc. published the original content used to generate this news brief on August 12, 2026, and is solely responsible for the information contained therein. © Copyright 2026 - Public Technologies (PUBT) Original Document: here