--- title: "Memory Capacity Negotiations Scheduled Through 2030! Winbond Electronics Accelerates Expansion Plan" type: "News" locale: "en" url: "https://longbridge.com/en/news/296420820.md" description: "Winbond Electronics has accelerated the expansion plan for Module B at its Kaohsiung Lujhu facility, with construction expected to begin in 2027 and equipment installation in 2029. Customer capacity negotiations are already scheduled for 2029–2030. Institutions believe AI-driven memory demand will \"persist for a considerable period.\" Additionally, Winbond has invested approximately NTD 4 billion in silicon capacitor (Si-Cap) production lines, with mass production expected as early as 2027, positioning it as a third growth driver beyond logic and memory" datetime: "2026-08-20T01:39:17.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/296420820.md) - [en](https://longbridge.com/en/news/296420820.md) - [zh-HK](https://longbridge.com/zh-HK/news/296420820.md) --- # Memory Capacity Negotiations Scheduled Through 2030! Winbond Electronics Accelerates Expansion Plan AI continues to drive expanding memory demand, forcing Winbond Electronics to advance its strategic layout—customers are already scrambling to secure capacity three years in advance. Winbond Electronics, a global leader in niche memory IDM, announced the accelerated expansion of its Kaohsiung Lujhu plant in Taiwan. The originally phased Phase II and Phase III projects have been merged into the simultaneous development of the Module B factory. According to the Taiwan Commercial Times, cleanroom construction is expected to begin in 2027, with equipment installation starting as early as early 2029. Industry analysts point out that Agentic AI is driving continuous increases in memory capacity and advanced packaging demand, with "related growth trends expected to persist for a considerable period." This is the direct reason behind Winbond’s decision to accelerate the Module B plan. **Customers are already negotiating capacity allocations for 2029 and 2030.** ## Quarterly Performance: Volume and Price Rise Together, Gross Margin Hits Record High Winbond Electronics reported consolidated revenue of NTD 59.843 billion in the second quarter, a 56.4% increase quarter-over-quarter and a 184.7% increase year-over-year. Price hikes were the core driver: DRAM prices rose by approximately 100% in a single quarter, while Flash prices increased by about 43%. Consequently, the gross margin climbed to 66.2%, with earnings per share (EPS) after tax reaching NTD 5.40. Entering the third quarter, the upward trend continues. Citing industry insiders, the Taiwan Commercial Times expects niche DRAM and SLC NAND to remain in short supply, with quarterly price increases of around 50%; NOR Flash prices are expected to rise by about 30% quarter-over-quarter, driven by active stockpiling from major cloud service provider (CSP) customers. Price increases in the fourth quarter are expected to narrow to 2%–5%. However, analysts believe that benefiting from increased DRAM capacity and shipment growth, Winbond’s revenue and profits can maintain a quarter-over-quarter growth trajectory. ## Module B: Product Line Fully Aligned with AI The product planning for Winbond’s Kaohsiung Module B covers Standard DRAM, CUBE DRAM, Wafer-on-Wafer (WoW), and silicon capacitors (Si-Cap). It will support 14nm and future 12nm DRAM processes, with plans to introduce EUV equipment in subsequent stages. The logic behind this layout is clear: AI is pushing memory toward higher density and more advanced packaging. Winbond needs to lock in processes and capacity in advance to avoid falling behind the market when customer demand materializes. Equipment introduction will proceed in stages based on customer demand forecasts and long-term agreements (LTA), rather than ramping up to full production at once, to control the pace of capital expenditure. ## Si-Cap: The Third Growth Curve Silicon capacitors (Si-Cap) are a notable aspect of this strategic layout deserving separate attention. Industry insiders view it as Winbond’s "third potential growth driver" beyond logic and memory. Winbond has invested approximately NTD 4 billion to build dedicated Si-Cap production lines. Currently, the capacitance density of mass-produced products is approximately 3,300 nF/mm², with the latest samples reaching about 5,400 nF/mm², primarily targeting AI advanced packaging and AI power management applications. Reports expect mass production to begin as early as the end of the first quarter of 2027. The rationale for Si-Cap is that AI chips have extremely high requirements for power stability. Silicon capacitors can provide higher-density power decoupling at the packaging level, making them indispensable supporting components for advanced packaging. Winbond’s early strategic move aims to secure a position in this emerging demand. ## Related News & Research - [Famous Hedge Fund Tiger Global Opened a New Position in This 1 AI Stock](https://longbridge.com/en/news/296381679.md) - [Goldman Sachs Says This 1 Stock Is Set to Be the Biggest AI Productivity Winner](https://longbridge.com/en/news/296259340.md) - [AI agent security must move beyond human-in-the-loop, experts say](https://longbridge.com/en/news/296269444.md) - [16:39 ETProsci Launches New AI Integration Program to Help Organizations Turn AI Investment Into Business Results](https://longbridge.com/en/news/296398714.md) - [Assessing Apple's Performance Against Competitors In Technology Hardware, Storage & Peripherals Industry](https://longbridge.com/en/news/296088631.md)