Recently, the AI computing power and high-end storage industries have continued to explode, driving the iteration and upgrading of advanced semiconductor packaging technology. Glass-based packaging has become a hot track of focus for both the capital market and the industry due to its outstanding performance advantages.

It is understood that with the iteration of high-end products such as AI server chips, high-speed computing chips, and HBM high-bandwidth storage, the demand for high-frequency, high-speed, and highly integrated packaging has surged. Traditional resin packaging substrates have shortcomings such as high signal loss, insufficient stability, and limited integration, making it difficult to meet the packaging requirements of high-end computing chips.

Glass-based packaging, with ultra-thin glass substrates as the core material, possesses core advantages such as low dielectric loss, high flatness, strong structural stability, and the ability for large-scale production. It can effectively reduce chip signal transmission delays and enhance packaging integration density, precisely addressing the packaging pain points of high-end computing chips. This makes it the core development direction for the next generation of advanced packaging, with clear growth potential in the industry.

BOE Technology Group and TCL Technology, as leading global semiconductor display companies, are expected to leverage their core glass processing technologies to proactively layout the glass-based packaging track, opening up growth space for transformation from display panels to advanced semiconductor packaging.

Previously, BOE announced a deep technical cooperation with global glass giant Corning in four areas: TGV glass-based packaging, foldable glass, perovskite glass substrates, and optical interconnects. TCL Technology also responded on Interactive Easy that the company is currently in the early research and technical exploration stage for glass-based packaging. Although both are still in the early stages, this has already released a clear signal: display panel companies are actively focusing on and exploring the cutting-edge direction of glass-based packaging, relying on their core advantages in glass manufacturing.

Currently, the dividends of the AI computing power industry continue to be released, and advanced packaging, as a core high-value-added link in the semiconductor industry chain, has sufficient long-term growth certainty. Display panel companies, based on their technological accumulation in precision glass manufacturing, have a clear underlying technical logic for laying out the glass-based packaging track. As display panel companies actively extend into the high-end semiconductor advanced packaging track based on their own accumulation and advantages, subsequent R&D progress and industrialization pace are also worthy of close market attention.

Data shows that one of the key technologies of glass-based packaging is TGV (Through Glass Via), which requires creating micron-level vertical vias on brittle glass and completing electrical connections. Display panel companies such as BOE and TCL Technology have a natural advantage in laying out glass-based packaging businesses based on decades of technology and experience accumulation in the semiconductor display industry: they are proficient in large-size glass forming, ultra-thin glass precision processing, coating, and precision photolithography, and these capabilities can be directly transferred to TGV. The mature dust-free production and precision glass processing technologies are highly compatible with the underlying manufacturing logic of glass-based packaging, providing solid support for the company's R&D and process iteration in advanced packaging technology