According to the official WeChat account of Jinfu Technology, the 0.08mm shovel-tooth cooling architecture customized and developed by Jinfu Technology has received an order from a certain Taiwanese customer and has been used in the liquid cooling system for the B200 chip. According to feedback from this customer, this architecture adopts the industry's latest MLCP technology, which has significant first-mover advantages and technological advancement, effectively addressing the TDP thermal effect issues of processors with power consumption of 1800W to 2000W and above, ensuring stable low-temperature operation of the processor module. In addition, the adaptation plan for the next-generation B300 chip has also completed multiple rounds of sample testing, with positive feedback, and is entering the production preparation stage