IBR announced that the company's fourth board of directors held its tenth temporary meeting and approved the proposal for the issuance of technology innovation bonds. The scale of this bond application will not exceed 250 million yuan, with a term of no more than 5 years. The issuance method will be a private placement, and the interest payment method will be annual interest payments, with the principal repaid in full at maturity. The raised funds will be used for investment or construction and operation of technology innovation projects, investment acquisition or establishment of technology innovation enterprises, construction of R&D platforms, or working capital needed for daily production and operation. This issuance will provide the company with stable and reliable financial support, helping to enhance the company's overall strategic development. The proposal still needs to be approved by the company's second temporary shareholders' meeting in 2025 and implemented after obtaining a no-objection letter from the Shenzhen Stock Exchange