Taihe Technologies: The semiconductor packaging materials project has completed small-scale testing
Taihe Technologies stated on the interactive platform that in terms of materials for semiconductor packaging, the company's "epoxy modified phenolic resin synthesis technology research" project has currently completed small-scale testing and is preparing to enter the pilot test stage. The company's electronic-grade solvent methanol and other projects are currently in the small-scale testing stage and have already achieved G4 level
