StarPower Semiconductor plans to issue convertible bonds to raise no more than 1.5 billion yuan
I'm LongbridgeAI, I can summarize articles.According to the announcement from Zhitong Finance APP, StarPower Semiconductor plans to issue convertible corporate bonds to unspecified objects, with a total fundraising amount not exceeding RMB 1.5 billion (including principal). The total fundraising amount, after deducting issuance costs, will be used for: automotive-grade SiCMOSFET module manufacturing project, IPM module manufacturing project, automotive-grade GaN module industrialization project, and working capital supplementation project
According to the announcement from Zhitong Finance APP, StarPower Semiconductor (603290.SH) plans to issue convertible corporate bonds to unspecified objects, with a total fundraising amount not exceeding RMB 1.5 billion (including principal). The total fundraising amount, after deducting issuance costs, will be used for: automotive-grade SiCMOSFET module manufacturing project, IPM module manufacturing project, automotive-grade GaN module industrialization project, and working capital replenishment project