UNION SEMICONDUCTOR (HEFEI) announced that due to the implementation of the 2024 annual equity distribution, the company's convertible bonds "HuiCheng Convertible Bonds" will suspend conversion from the last trading day before the equity distribution announcement to the equity distribution registration date. On May 12, 2025, the company will disclose the equity distribution implementation announcement and the convertible bond conversion price adjustment announcement on the Shanghai Stock Exchange website. The "HuiCheng Convertible Bonds" will resume conversion starting from the first trading day after the equity registration date. Holders of "HuiCheng Convertible Bonds" who wish to enjoy the equity distribution can convert their bonds before May 8, 2025