Kioxia, SanDisk unveil joint 10th-gen QLC 3D NAND technology at FMS
I'm LongbridgeAI, I can summarize articles.SanDisk and Kioxia unveiled their joint 10th-generation QLC 3D NAND technology, targeting AI and cloud storage. Utilizing CBA wafer bonding, the new memory achieves a bit density exceeding 37 Gb/mm², a 60% increase over the 8th generation. It features Toggle DDR6.0 interface speeds of 4.8 Gb/s, with design optimizations aimed at increasing bandwidth and reducing I/O power consumption.
- SanDisk, working with Kioxia, unveiled 10th-generation QLC 3D flash memory targeting AI and cloud storage architectures. * Technology uses CBA wafer bonding; bit density rises up to 60% versus the 8th generation to more than 37 Gb/mm². * Interface speed reaches 4.8 Gb/s using Toggle DDR6.0; design changes aim to lift bandwidth and cut I/O power use. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. SanDisk Corporation published the original content used to generate this news brief on August 04, 2026, and is solely responsible for the information contained therein. © Copyright 2026 - Public Technologies (PUBT) Original Document: here