Kyocera Corporation, based in Kyoto, Japan, has revealed its plans to release a new multilayer ceramic core substrate designed for advanced semiconductor packages including xPUs and switch ASICs. These products are experiencing increased complexity as AI data center architectures progress. The unveiling of the new product is set to take place at ECTC 2026, a global conference focusing on semiconductor packaging technologies, to be held in Orlando, Florida, USA, from May 26-29, 2026. The President of Kyocera Corporation, Shiro Sakushima, shared this development, highlighting the company's commitment to innovation in the semiconductor industry.