---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000186316.md"
description: "TSMC’s expansion of CoWoS advanced chip packaging capacity appears to have hit some turbulence, media report, with the AP5 complex in the Central Taiwan Science Park set to merge operations & personnel at plants AP5A and AP5B due to falling capacity utilization; while at the AP8 complex in the Southern Taiwan Science Park, much equipment has arrived, but installation has been delayed to the end of 2025. 1/2 $NVIDIA(NVDA.US) $AMD(AMD.US) $Broadcom(AVGO.US) $Alphabet(GOOGL.US) #SemiconductorsSource: Dan Nystedt"
datetime: "2025-08-11T01:57:20.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000186316.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000186316.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000186316.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC’s expansion of CoWoS advanced chip packaging …


### Related Stocks

- [AVGO.US](https://longbridge.com/en/quote/AVGO.US.md)
- [NVDA.US](https://longbridge.com/en/quote/NVDA.US.md)

---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**