---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000217923.md"
description: "Japan’s Resonac, the semiconductor materials giant, has established a 27-company consortium (JOINT3) to develop materials, equipment and design tools for 515 x 510mm square organic interposers for next-gen advanced chip packaging (panel-level-packaging), media report. The group will invest 26 billion yen ($175 million) over 5-years to build a prototype production line at an R&D center in Yuki City, north of Tokyo. They aim to have it up and running next year. $Applied Materials(AMAT.US) $CAJ $Lam Research(LRCX.US) $3M(MMM.US) $Synopsys(SNPS.US) $Tokyo Electron(TOELY.US) #semiconductorsSource: Dan Nystedt"
datetime: "2025-09-04T02:04:46.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000217923.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000217923.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000217923.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Japan’s Resonac, the semiconductor materials giant…


### Related Stocks

- [AMAT.US](https://longbridge.com/en/quote/AMAT.US.md)
- [SNPS.US](https://longbridge.com/en/quote/SNPS.US.md)

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**