---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000217952.md"
description: "TSMC is racing to finish verification of its COUPE silicon photonics engine this year to integrate it into the CoWoS packaging next year for a complete co-packaged optics (CPO) product, aimed at boosting data speeds in AI data centers while cutting energy use, media report, adding key partners include subsidiary VisEra Technologies and US-based Marvell. The report says TSMC filed for 50 patents related to silicon photonics in the US last year, versus 26 for Intel. $Taiwan Semiconductor(TSM.US) $Marvell Tech(MRVL.US) $Intel(INTC.US) #semiconductorsSource: Dan Nystedt"
datetime: "2025-09-04T02:04:48.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000217952.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000217952.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000217952.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC is racing to finish verification of its COUPE…


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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**