---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000228566.md"
description: "TSMC and local rivals are making steady progress in advanced panel-level packaging (FOPLP), with mass production expected by 2027, media report. New equipment has passed muster, and trial production lines humming. Powertech, Taiwan’s 2nd largest chip packaging firm, achieved a 90% yield rate on its 515x515mm FOPLP trial line, while ASE is working on 600x600mm panels and Innolux on 700x700mm. TSMC is focusing on 315x315mm panels, with an FOPLP R&D team, a trial production line, and investments in PLP+TGV and glass substrate technologies. 1/2 $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #Powertech #InnoluxSource: Dan Nystedt"
datetime: "2025-09-12T01:04:46.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000228566.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000228566.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000228566.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC and local rivals are making steady progress i…


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**