---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000244243.md"
description: "Nvidia and TSMC may turn to silicon carbide (SiC) to overcome heat problems as the hefty power used by the latest AI chips creates heat that must be vented before the chip slows, glitches or fries, media report. 1/3 $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) #semiconductors #semiconductor #SiCSource: Dan Nystedt"
datetime: "2025-09-23T00:42:13.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000244243.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000244243.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000244243.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Nvidia and TSMC may turn to silicon carbide (SiC) …


### Related Stocks

- [NVDA.US](https://longbridge.com/en/quote/NVDA.US.md)
- [TSM.US](https://longbridge.com/en/quote/TSM.US.md)

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**