---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000336801.md"
description: "Rumor: TSMC Arizona may start building an advanced semiconductor packaging plant ahead of schedule on land currently set aside for fab P6, media report, with equipment installation possible by end-2027 if construction is smooth. TSMC had originally partnered with Amkor to provide advanced packaging when its Arizona facility is ready, but that’s not expected to be until 2028. $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $AMD(AMD.US) #Semiconductors #semiconductorSource: Dan Nystedt"
datetime: "2025-12-04T00:46:06.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000336801.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000336801.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000336801.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Rumor: TSMC Arizona may start building an advanced…


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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**