---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000341003.md"
description: "$Intel(INTC.US) According to reports, TSMC's wafer-level packaging technology is in strong demand! Companies including Nvidia, Alphabet (Google's parent), Amazon, Broadcom, and MediaTek are racing to secure production capacity for next-generation AI chips. TSMC's CoWoS production lines are already operating at full capacity. AI giants are driving capacity expansion plans through 2026!"
datetime: "2025-12-08T08:29:07.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000341003.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000341003.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000341003.md)
author: "[新用户_GBbMlq](https://longbridge.com/en/profiles/17077390.md)"
generator: "portal-rs"
---

# $Intel(INTC.US) According to reports, TSMC's wafer…


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**