---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000416256.md"
description: "Samsung’s 2nm process is a real threat to TSMC in smartphone chips, media report, as Samsung’s Exynos 2600 chip revealed a breakthrough FoWLP-HPB packaging technique better-able to cool chips, appealing to giants like Apple, MediaTek, Qualcomm. FoWLP-HPB: Fan-Out Wafer-Level Packaging (w/integrated) Heat Path Block $SSNLF $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $Qualcomm(QCOM.US) #mediatek #semiconductors #smartphonesSource: Dan Nystedt"
datetime: "2026-01-22T02:21:21.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000416256.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000416256.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000416256.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Samsung’s 2nm process is a real threat to TSMC in …


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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**