---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000428941.md"
description: "Powertech plans to spend NT$44.3 billion (US$1.4B) over 3-years to expand advanced semiconductor packaging called FOPLP (Fan-out Panel Level Packaging) as AI-related demand continues to surge, media report, adding subsidiary TeraPower will add 400 to 500 new testing machines to support the FOPLP buildout (wafer and final testing). #Powertech $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US)Source: Dan Nystedt"
datetime: "2026-01-28T01:51:20.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000428941.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000428941.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000428941.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Powertech plans to spend NT$44.3 billion (US$1.4B)…


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**