---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000574542.md"
description: "TSMC plans to convert several older, 8-inch wafer fabs into advanced packaging plants as the shortage worsens, media report, while next-gen CoPoS mass production is planned for 2028-2029 at plant AP7 in Chiayi, south Taiwan. Chiayi is TSMC’s biggest advanced packaging site. CoWoS advanced packaging volume is expected to reach 2 million wafers in 2027, from 1.3 million this year. 1/2 $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductors #semiconductorSource: Dan Nystedt"
datetime: "2026-04-12T23:27:28.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000574542.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000574542.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000574542.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC plans to convert several older, 8-inch wafer …


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- [TSM.US](https://longbridge.com/en/quote/TSM.US.md)
- [AMKR.US](https://longbridge.com/en/quote/AMKR.US.md)

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**