---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000613384.md"
description: "TSMC advanced packaging: A single CoWoS wafer now costs US$10,000 due to the shortage and high demand as it is vital to high-performance AI chips, media report. The high price means profits for TSMC because packaging equipment is far less expensive than fab equipment, meaning lower capex per-unit. TSMC’s 2026 capacity is seen at 1.3 million wafers (total), and 2.0M in 2027. Advanced packaging accounted for around 10% of TSMC’s 2025 revenue. $Taiwan Semiconductor(TSM.US) $BESI #Advantest #ASMI $Applied Materials(AMAT.US) $KLA(KLAC.US) #semiconductorsSource: Dan Nystedt"
datetime: "2026-04-27T23:37:20.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000613384.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000613384.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000613384.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC advanced packaging: A single CoWoS wafer now …


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**