---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000747681.md"
description: "TSMC will outsource CoWoS work to Amkor Arizona as part of the 10-year deal they inked, and TSMC’s first US advanced packaging plant (AP1) will focus on SoIC packaging instead, media report. CoWoS (Chip on Wafer on Substrate): 2.5D packaging, older than SoIC (3D).SoIC (Silicon on Integrated Chips) $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductorsSource: Dan Nystedt"
datetime: "2026-06-18T02:15:40.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000747681.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000747681.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000747681.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# TSMC will outsource CoWoS work to Amkor Arizona as…


### Related Stocks

- [AMKR.US](https://longbridge.com/en/quote/AMKR.US.md)
- [TSM.US](https://longbridge.com/en/quote/TSM.US.md)

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**