---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000801019.md"
description: "Broadcom and Taiwan’s Powertech will invest US$400 million on a joint venture plant in Singapore for high-end chip packaging substrates, media report, citing Powertech regulatory filings. Powertech developed Fan-Out Panel-Level-Packaging (FOPLP) for large-sized chips such as those used in AI data centers. It also counts AMD as a client for FOPLP. $Broadcom(AVGO.US) $AMD(AMD.US) #Powertech #SingaporeSource: Dan Nystedt"
datetime: "2026-07-17T00:35:50.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000801019.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000801019.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000801019.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# Broadcom and Taiwan’s Powertech will invest US$400…


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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**