---
type: "Topics"
locale: "en"
url: "https://longbridge.com/en/topics/100000000861373.md"
description: "This is a cool look at where we are in the packaging “cycle.”And based on the differences in what is driving this cycle, it should be bigger than the last one.The last cycle was driven heavily by wire bonder capacity for mainstream products, with PCs a major source of demand during COVID.But this time, the mix is very different.Source: Chips & Wafers"
datetime: "2026-08-19T15:37:03.000Z"
locales:
  - [en](https://longbridge.com/en/topics/100000000861373.md)
  - [zh-CN](https://longbridge.com/zh-CN/topics/100000000861373.md)
  - [zh-HK](https://longbridge.com/zh-HK/topics/100000000861373.md)
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203.md)"
generator: "portal-rs"
---

# This is a cool look at where we are in the packagi…


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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**